The Hack3D competition serves to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing (AM) field. In the 2020 Qualifying Round, participants were challenged to model a CAD design from curves of a stolen IGES file, employing skills in file forensics and reverse-engineering.
To access this event, please log into the
CSAW'20 platform and visit the
DTCC Auditorium. If you are already logged into the platform, exit this agenda and enter the
Auditorium. PhD Student Coordinator:
Gary Mac, NYU Tandon School of Engineering
Post-Doctoral Lead:
Hammond Pearce, NYU Center for Cybersecurity
Faculty Lead:
Nikhil Gupta, NYU Center for Cybersecurity
In the Final Round, finalist teams will be presented with the AM security challenge file on Nov. 2 and will have 4 days to work as a team to develop a solution to the problem.
Teams' challenge solutions will be presented during these live presentations:
DC-War-Story, Malaviyanagar Nat'l Institute of Technology, India
Fleck, National Institute of Tech. Karnataka Surathkal, India
Cobra, NYU Tandon School of Engineering, USA
Blue Hens, University of Delaware, USA
JudgesNikhil Gupta
, NYU Center for Cybersecurity
Simona Hunyadi Murph, Savannah River National Laboratory, Fellow Scientist
Event LocationCSAW Platform | DTCC Auditorium | Live Webinars Track